镀锡电镀工艺及MSA电镀体系添加剂的研究

Progress of Tin Electroplating Process and Additive in the MSA Plating System

摘要: 综述了各类镀锡电镀工艺的特点，重点阐述了甲基磺酸盐（MSA）电镀体系及表面活性剂、稳定剂和光亮剂在MSA电镀体系中的功能与作用，并对MSA电镀体系添加剂的应用作了详细分析，指明了目前MSA电镀体系存在的问题及该领域主要研究方向。

Abstract: The characteristics of various electroplating tin process were summarized, and the methanesulfonate (MSA) plating systems were mainly presented in this paper. The functions of surfactant, stabilizer and brightener in MSA plating system were described and the application of additives in MSA plating system was analysized in detail, and the existing problems of MSA plating system and the main research direction in this field were pointed out.