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侯文忱,宋孟. Cu−3.27Ti合金热变形行为及组织演变过程[J]. 安徽工业大学学报(自然科学版),xxxx,x(x):x-xx. doi: 10.12415/j.issn.1671-7872.24047
引用本文: 侯文忱,宋孟. Cu−3.27Ti合金热变形行为及组织演变过程[J]. 安徽工业大学学报(自然科学版),xxxx,x(x):x-xx. doi: 10.12415/j.issn.1671-7872.24047
HOU Wenchen, SONG Meng. Thermal Deformation Behavior and Microstructure Evolution of Cu−3.27Ti Alloy[J]. Journal of Anhui University of Technology(Natural Science). DOI: 10.12415/j.issn.1671-7872.24047
Citation: HOU Wenchen, SONG Meng. Thermal Deformation Behavior and Microstructure Evolution of Cu−3.27Ti Alloy[J]. Journal of Anhui University of Technology(Natural Science). DOI: 10.12415/j.issn.1671-7872.24047

Cu−3.27Ti合金热变形行为及组织演变过程

Thermal Deformation Behavior and Microstructure Evolution of Cu−3.27Ti Alloy

  • 摘要: 利用Gleeble-3500热模拟试验机,在变形温度为750 ~ 900 ℃、应变速率为0.1 ~ 10.0 s−1的条件下对铸态Cu−3.27Ti合金进行热压缩模拟试验,在此基础上构建Cu−3.27Ti合金高温本构关系模型、绘制热加工图,研究热变形温度、应变速度对Cu−3.27Ti合金热变形行为和组织演变过程的影响,优化热变形工艺参数。结果表明:建立的高温本构关系模型可较好地表征Cu−3.27Ti合金变形温度、应变速率以及流变应力之间的关系,热加工图显示合金存在1个功率耗散峰值区和2个流变失稳区,功率耗散峰值约0.27,对应的变形条件为900 ℃,功率耗散峰值区与失稳区不重叠,理论上900 ℃条件下Cu−3.27Ti合金的热加工性能较好;变形温度和应变速率对Cu−3.27Ti合金微观组织动态再结晶比例和再结晶晶粒平均直径均有明显影响,两者均随变形温度和应变速率的升高而上升,当组织完全再结晶后变形温度和应变速率对晶粒平均直径的影响更显著;Cu−3.27Ti合金在750 ℃变形时细小的再结晶晶粒呈链状组织分布于初始晶粒周围,呈现出流变失稳特征,变形条件为900 ℃/10.0 s−1时,合金的微观组织完全再结晶且晶粒较细小均匀,较适于进行热加工。

     

    Abstract: The hot compression simulation test of Cu−3.27Ti alloy as cast was carried out with Gleeble-3500 thermal simulation testing machine at deformation temperature of 750-900 ℃ and strain rate of 0.1-10.0 s−1. On this basis, the high temperature constitutive relation model of Cu−3.27Ti alloy was established and the hot working diagram was drawn. The effects of thermal deformation temperature and strain rate on the thermal deformation behavior and microstructure evolution of Cu−3.27Ti alloy were studied, and the technological parameters of thermal deformation were optimized. The results show that the established high temperature constitutive relation model can well characterize the relationship between deformation temperature, strain rate and flow stress of Cu−3.27Ti alloy. The hot working diagram shows that there is one peak power dissipation region and two rheological instability regions in Cu−3.27Ti alloy, the peak power dissipation is about 0.27, the corresponding deformation condition is 900 ℃, and the peak power dissipation region does not overlap with the instability region. Theoretically, Cu−3.27Ti alloy has better thermal workability at 900 ℃. Deformation temperature and strain rate have obvious effects on the dynamic recrystallization ratio and average diameter of recrystallization grains of Cu−3.27Ti alloy microstructure. The dynamic recrystallization ratio and average diameter of recrystallization grains increase with the increase of deformation temperature and strain rate, and the influence of deformation temperature and strain rate on the average diameter of grain becomes more significant when the microstructure is completely recrystallized. When Cu−3.27Ti alloy is deformed at 750 ℃, the fine recrystallized grains are distributed around the initial grains in chain structure, showing rheological instability characteristics. When the deformation condition is 900 ℃/10.0 s−1, the microstructure of the alloy has been completely recrystallized and the grains are relatively small and uniform, which is suitable for hot processing.

     

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