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PAN Mengya, LI Ping, CEN Yuwan, WANG Wenjiang, ZHANG Qianfeng. Progress of Tin Electroplating Process and Additive in the MSA Plating System[J]. Journal of Anhui University of Technology（Natural Science）, 2017, 34(3): 254-259. DOI: 10.3969/j.issn.1671-7872.2017.03.008
Citation: PAN Mengya, LI Ping, CEN Yuwan, WANG Wenjiang, ZHANG Qianfeng. Progress of Tin Electroplating Process and Additive in the MSA Plating System[J]. Journal of Anhui University of Technology（Natural Science）, 2017, 34(3): 254-259. DOI: 10.3969/j.issn.1671-7872.2017.03.008
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Progress of Tin Electroplating Process and Additive in the MSA Plating System

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  • The characteristics of various electroplating tin process were summarized, and the methanesulfonate (MSA) plating systems were mainly presented in this paper. The functions of surfactant, stabilizer and brightener in MSA plating system were described and the application of additives in MSA plating system was analysized in detail, and the existing problems of MSA plating system and the main research direction in this field were pointed out.
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